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PCB
ASSEMBLIES
Sienna offers a broad spectrum
of solutions for PCB design and assembly.
We have established our potential to
meet the unique and diverse needs of
customers and are leaders in using advanced
PCB assembly and testing processes and
technologies. We have the ability to
provide end-to-end solutions from our
locations worldwide. We understand that
the assembly industry is a skill and
process intensive industry and so have
invested to a great extent in technology
and skills to ensure that our global
partners have access cost effective,
scalable solutions that are developed
using the best of technologies.
Our production services are flexible
and based on the customer needs and
can handle low volume and high volume
production of both high and low-mix
products with equal efficiency. With
our production facilities placed strategically
across the globe, we can provide scalable
solutions that cater to your unique
supply and demand chains. Throughout
the design, assembly and testing stages,
quality holds the highest priority.
This is evident from the fact that we
inspect our PC board Assemblies to IPC-610C.
We are transforming to lead-free manufacturing
and assembly and will soon be delivering
completely lead-free solutions to our
customers.
We have also enforced flexible assembly
lines that can be easily and efficiently
turned around to evolve highly optimized
assembly lines that have a direct impact
on the quality, reliability, speed of
operations and above all faster time
to market.
PRODUCTION
CAPABILITES
Complex
double-sided PCB assembly
Ball
grid array
In
circuit and functional testing
High
complex assembly
High
mix, low volume assembly
Back
planes
SMT
placement capabilities
Through-hole
and mixed technology assembly
SURFACE
MOUNT TECHNOLOGY
Sienna offers a wide range of services
for customers seeking expertise in the
Surface Mount Technology depending on
their preference. Our production line
configurations are flexible to expansions
apart from being adaptable to unique
production requirements and range from
prototypes to high mix production. Our
conformance to standards while relentlessly
working for peak performance ensures
complete satisfaction of our global
partners.
Sienna Corporation has a complete SMT
infrastructure put in place with state
of the art equipment and also has a
team of experienced professionals .We
can handle single or dual side SMT assemblies
as well as mixed technology for simple
SMT assemblies to highly integrated
combinations. Our equipment can handle
all aspects of manufacturing including
small pre productions to mass production.
Production capabilities include:
Pin-through-hole
technology
Ball-grid
array (BGA) and mBGA
Flip
chip capability
Fine-pitch
- 12 mil pitch
0402
components
BALL
GRID ARRAY
As electronic devices become more and
more complex, smarter technologies evolve
to counter the forces of market change.
One such technology that was developed
as a packaging alternative for high
I/O devices was the ball grid array.
Sienna Corporation makes this high-end
technology available to all its partner
OEMs.
Ball grid arrays, which fall under the
category of Surface Mount Technology,
have reduced the co-planarity and placement
problems. It has better performance
characteristics with regard to thermal
and electrical characteristics. Though
BGA is considered as a low cost alternative
to fine pitch leaded surface mount,
it offers specific advantages.
Reduced
handling problems
Higher
board assembly yields
Quick
design to product cycle time
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